Noctua NT-H1 Thermal Compound

Posted on September 15, 2008
Author: Sean Potter
Pages: 1 2 3 4
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Performance

One of the features on Noctua's packaging was "Top-performance right from the start", meaning the compound didn't need any burn-in time to "perform". As my results will show, the NT-H1 does indeed perform from the start, but performance also increases after a few hours of usage.

In one test, I utilized OCCT to push the CPU to 100% usage and measured temperatures while the machine was both idle and under load. In a second test, I had the machine laborously compile KDE in Gentoo Linux. Let's look at the average of the two tests.

State Stock Thermal Pad NT-H1 Immediate NT-H1 12-hour Burn-in
Idle
40°C
37°C
35°C
Load
52°C
48°C
42°C

Final Thoughts & Conclusion

After look at Noctua's NF-P12 120mm case fan, I was convinced that Noctua knew cooling. The NT-H1 thermal compound only reaffirms this. It also proves that every aspect of cooling is important, not just the size of a heatsink or speed of a fan.

A solid improvement is clearly visible in my test results — the NT-H1 compound works. There's about a 12% increase in performance overall, and the results definitely favored leaving the compound some time to burn-in.

Sufficient to say that these results will have me using Noctua's NT-H1 compound any time I mount a new heatsink in the future. Not only is the compound useful for CPU heatsinks, but could also be used in applications such as Northbridge or GPU heatsinks as well. Users will simply have to watch that not too thick an amount of compound is applied, as it could potentially damage the chip with the pressure of the heatsink clamp pulling down.

Pros

  • Easy application
  • Attractive and detailed packaging
  • Very effective
  • Non-conductive. Won't damage electrical components by merely touching.

Cons

  • None!

Rating

10/10

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